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Solder Paste Flux Mobile Phone PCB Repair For XSn63/Pb37 - XGSP-50 42G

Size: 35g

The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips. It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.

• This set of tools breaks through the problem of low success rate of traditional mainboard repairing.
• Greatly reduced the difficulty of motherboard maintenance.
• The mystery lies in professionalism of the soldering paste .There is no different between this product and original middle layer tin. The tin melting point of the CPU area is slightly lower than the that of surrounding.

Model: UV50

Color: Yellow

Viscosity: 0.2PaS

Granularity: 0.22um

Green formula manufacturing, the first choice of tin planting, BGA planting tin paste Scope of application: suitable for sensor, wire, motor, safety tube, connector, metal shell, lamp decoration, electronic component, SMT maintenance, BGA chip tin.

Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.

Mild pH, no corrosives to IC or PCB.

Transparent residue, no washing needed.

Melting point is slightly higher than soldering tin.

Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.

Mild pH, no corrosives to IC or PCB.

Transparent residue, no washing needed.

Melting point is slightly higher than soldering tin.

Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.

Mild pH, no corrosives to IC or PCB.

Transparent residue, no washing needed.

Melting point is slightly higher than soldering tin.

Good Special Effects contact solder.

Newest Preparation.

Lead-Free No Halonge.

Medium Temperature solder pate melting point 183 Degree.

when the components of the patch cannot withstand 200 degree.

And Above temperature,using medium temperature solder paste for welding process.

Protected from high temperature reflow soldering components.