MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool
Functions for:
- Soldering paste for cell phone PCB and SMD etc.
- Help to repair the circuit boards and protect the electronic components.
- A necessary material for repairing the mobile phone mainboard.
- Flux Solder Paste - no clean soldering.
BGA Solder Paste
- Perfect for EMMC chip change
- Perfect for other circuitry reworking and repair
- Joint high intensity
- Good immersion
- Good insulating ability
- Soldering paste for cell phone PCB and SMD like BGA, PGA, etc.
- Help to repair the circuit boards and protect the electronic components
- A necessary material for repairing the mobile phone mainboard
Package Include:
