WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 7 7Plus
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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 7 7Plus


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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 7 7Plus

  • $14.25
Qté:  
  • Poids
    0.3 kg
  • Réf.
    10000000197

WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 7 7Plus

C Chip BGA Reballing Stencil Tin Steel Net for iPhone 7 7Plus, iPhone HDD Nand / Baseband Repair BGA Reballing Net
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate

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