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Solder Paste Flux Mobile Phone PCB Repair For XSn63/Pb37 - XGSP-50 42G
Size: 35g
MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool
Functions for:
BGA Solder Paste
Package Include: