WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus


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WL High-Quality NIC Chip BGA Reballing Stencil Tin Steel Net for iPhone 6 6Plus, iPhone HDD Nand / Baseband Repair BGA Reballing Net. With Fixed Plate, Easy to use and more accurate IC welding positionAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus.

  • $14.25
Qty:  
  • Weight
    0.3 kg
  • SKU
    10000000199

WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus

IC Chip BGA Reballing Stencil Tin Steel Net for iPhone 6 6Plus, iPhone HDD Nand / Baseband Repair BGA Reballing Net
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate

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