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BGA IC Chip Repair Blade CPU Remover For Mobile Phone Logic Board Repair Tool
How to use:
1. Remove the chip when the required blade into the hilt, and then clean the edge of the knife position glue and the black glue around the chip, temperature 200.
2. The hot air gun opened to 150 degrees, the wind speed of 60, the motherboard for the pre-heat treatment of 2 minutes.
3. The hot air gun replaced the small head, the temperature open to 350 degrees,first blows the knife position 10 seconds, however the back and left shaking to the bottom of the chip insert.
Package Include:
BGA IC Chip Repair Blade CPU Remover For Mobile Phone Logic Board Repair Tool x 1 Pieces