0.12MM Multi-Function Exynos 5430 CPU BGA Reballing Stencil Plant Tin Steel Net For Meizu MX4 Pro
Zoom image

0.12MM Multi-Function Exynos 5430 CPU BGA Reballing Stencil Plant Tin Steel Net For Meizu MX4 Pro


Not rated yet
Vorrätig (100 Artikel sind verfügbar)

0.12MM Multi-Function Exynos 5430 CPU BGA Reballing Stencil Plant Tin Steel Net For Meizu MX4 Pro

  • $5.99
Stck :  
  • Gewicht
    0.3 kg
  • Art.-Nr.
    10000000195

0.12MM Multi-Function Exynos 5430 CPU BGA Reballing Stencil Plant Tin Steel Net For Meizu MX4 Pro

Package Include:

BGA Reballing Stencil x 1 Pieces

Customer reviews
Please sign in to add review
There are no comments yet. Be the first to leave a comment
Related products
Legen Artikel hier ab, um einzukaufen
Der Artikel ist in den Warenkorb gelegt worden
Kasse
  • In den Warenkorb ziehen und ablegen
    Pcb Circuit Board Holder, Mobile Phone Motherboard Repair Fixture Holder PCB Soldering Repair Holder with BGA Groove for 6 6S 6SP 7 7P 8 8P X XR Repair Hand Tool
     
    Pcb Circuit Board Holder, Mobile Phone Motherboard Repair Fixture Holder PCB Soldering Repair Holder with BGA Groove for 6 6S 6SP 7 7P 8 8P X XR Repair Hand Tool
    • $26.99

    Not rated yet
  • In den Warenkorb ziehen und ablegen
    X9 Rosin Flux Solder Paste BGA PCB PGA SMD Soldering Paste Flux For Electric Soldering Iron Welding Fluxes
     
    X9 Rosin Flux Solder Paste BGA PCB PGA SMD Soldering Paste Flux For Electric Soldering Iron Welding Fluxes
    • $2.99

    Not rated yet