Solder Paste Flux Mobile Phone PCB Repair For XSn63/Pb37 - XGSP-50 42G

MECHANIC  High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip  Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool

Functions for:

• Soldering paste for cell phone PCB and SMD etc. 
• Help to repair the circuit boards and protect the electronic components.
• A necessary material for repairing the mobile phone mainboard.
• Flux Solder Paste - no clean soldering.

BGA Solder Paste

• Perfect for EMMC chip change
• Perfect for other circuitry reworking and repair
• Joint high intensity
• Good immersion
• Good insulating ability
• Soldering paste for cell phone PCB and SMD like BGA, PGA, etc.
• Help to repair the circuit boards and protect the electronic components
• A necessary material for repairing the mobile phone mainboard

Package Include:

• 1 pcs x xgsp50