G-Lon Co Develop Middle Board BGA Reballing Stencil Plant Tin Platform Solder Paste For iPhone x Maintenance

Sunshine & G-Lon Co-Develop Middle Board BGA Reballing Stencil Plant Tin Platform+Solder Paste For iPhone x Maintenance

• This set of tools breaks through the problem of low success rate of traditional mainboard repairing.
• Greatly reduced the difficulty of motherboard maintenance.
• The mystery lies in professionalism of the soldering paste .There is no different between this product and original middle layer tin. The tin melting point of the CPU area is slightly lower than the that of surrounding.
• This  solder paste uses the principle of temperature difference,Easily blow CPU without touching the peripheral accessories.
• Within the fine temperature difference,Makes the entire maintenance efficiency greatly improved.
• Even green hands can plant tin perfectly

Package Include:

1 pcs x Glon Bga reballing