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Free	Drag and drop me to the cart High Precision 3D BGA Reballing Stencil Template Professional Planting Tin Net BGA IC Chipset For iPhone A11 CPU i8/i8P/iX For iPhone A 118 8P X $24.99 Not rated yet

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FULL PACKAGE of 16 X QianLi ToolPlus 3D Black Stencils For iPhone Chip Reballing

SAVE MONEY WITH THIS FULL 16 PIECE PACKAGE

This COMPLETE FULL PACKAGE contains ALL 16 Black 3D Stencils by QianLi ToolPlus. The 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using these stencils.

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3D Logic Board Mechanic Reballing Stencil For iPhone XS and XS Max

Use this stencil to reball the connection between the main and RF logic boards on iPhone XS and iPhone XS Max

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G-Lon Co Develop Middle Board BGA Reballing Stencil Plant Tin Platform Solder Paste For iPhone x Maintenance

This set of tools breaks through the problem of low success rate of traditional mainboard repairing.
Greatly reduced the difficulty of motherboard maintenance.
The mystery lies in professionalism of the soldering paste .There is no different between this product and original middle layer tin. The tin melting point of the CPU area is slightly lower than the that of surrounding.

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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 7 7Plus

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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6S / 6S Plus

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WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus

WL High-Quality NIC Chip BGA Reballing Stencil Tin Steel Net for iPhone 6 6Plus, iPhone HDD Nand / Baseband Repair BGA Reballing Net. With Fixed Plate, Easy to use and more accurate IC welding positionAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus.