High Precision 3D BGA Reballing Stencil Template Professional Planting Tin Net BGA IC Chipset For iPhone A11 CPU i8/i8P/iX
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High Precision 3D BGA Reballing Stencil Template Professional Planting Tin Net BGA IC Chipset For iPhone A11 CPU i8/i8P/iX


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For iPhone A 118 8P X

In stock (1000 items available)
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  • $24.99
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  • Weight
    0.3 kg
  • SKU
    10000000431

High Precision 3D BGA Reballing Stencil Template Professional Planting Tin Net BGA IC Chipset for iPhone A11 CPU Repair

Package Include:

  • 1 pcs x MJ 3D Reballing Stencil for iPhone A11 CPU i8/i8P/iX

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